一站式服務 封裝產(chǎn)品 測試服務 仿真設計 FA&RA 當前位置:首頁-封測服務-仿真設計-Mechanical 仿真設計 Electrical SI、PI EMITime domainSoftwave:HFSS/NPE SIwave/PowerSISnpExpert Mechanical reliabilitystress/strainwarpageSoftware:ANSYS Thermal Thermal resistanceHeat bottleneckisothermSoftware:Flotherm Mold Flow Filling analysisWire SweepFrame DeviationSoftware:Mode3D Packaging reliability analysis Bump stress distribution and risk point prediction in FC packaging Warpage simulation 返回頂部 FA&RA